JPH0749732Y2 - 半田付け実装部品のリ−ド - Google Patents

半田付け実装部品のリ−ド

Info

Publication number
JPH0749732Y2
JPH0749732Y2 JP1987200671U JP20067187U JPH0749732Y2 JP H0749732 Y2 JPH0749732 Y2 JP H0749732Y2 JP 1987200671 U JP1987200671 U JP 1987200671U JP 20067187 U JP20067187 U JP 20067187U JP H0749732 Y2 JPH0749732 Y2 JP H0749732Y2
Authority
JP
Japan
Prior art keywords
lead
solder
land
hole
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987200671U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01103273U (en]
Inventor
洽 小林
Original Assignee
ティアツク株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ティアツク株式会社 filed Critical ティアツク株式会社
Priority to JP1987200671U priority Critical patent/JPH0749732Y2/ja
Publication of JPH01103273U publication Critical patent/JPH01103273U/ja
Application granted granted Critical
Publication of JPH0749732Y2 publication Critical patent/JPH0749732Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987200671U 1987-12-28 1987-12-28 半田付け実装部品のリ−ド Expired - Lifetime JPH0749732Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987200671U JPH0749732Y2 (ja) 1987-12-28 1987-12-28 半田付け実装部品のリ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987200671U JPH0749732Y2 (ja) 1987-12-28 1987-12-28 半田付け実装部品のリ−ド

Publications (2)

Publication Number Publication Date
JPH01103273U JPH01103273U (en]) 1989-07-12
JPH0749732Y2 true JPH0749732Y2 (ja) 1995-11-13

Family

ID=31491067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987200671U Expired - Lifetime JPH0749732Y2 (ja) 1987-12-28 1987-12-28 半田付け実装部品のリ−ド

Country Status (1)

Country Link
JP (1) JPH0749732Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12199194B2 (en) 2019-11-28 2025-01-14 Kyocera Corporation Wiring base, package for storing semiconductor element, and semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2529849Y2 (ja) * 1990-12-25 1997-03-19 ヒロセ電機株式会社 表面実装用コネクタの補強金具構造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58125373U (ja) * 1982-02-18 1983-08-25 富士通株式会社 プリント配線板
JPS5947747A (ja) * 1982-09-10 1984-03-17 Hitachi Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12199194B2 (en) 2019-11-28 2025-01-14 Kyocera Corporation Wiring base, package for storing semiconductor element, and semiconductor device

Also Published As

Publication number Publication date
JPH01103273U (en]) 1989-07-12

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